Paper presented at THERMINIC11 conference, Paris, 2011.

This paper presents a thermal model for Intel Single-chip Cloud Computer. The thermal model is mainly based on Hotspot.

Download : Sadri_THERMINIC11

Abstract :  Spatial and temporal non-uniformities of workload and power consumption advanced Systems-on-Chip (SoC) platforms result in localized high power densities, which lead to temperature hot-spots, gradients and thermal cycles that may cause non-uniform ageing and accelerated chip failure. The Single-Chip Cloud Computer (SCC) is an experimental many-core processor created by Intel Labs and it integrates thermal sensors to track the chip thermal behavior. Unfortunately these sensors provide a limited introspection on the full-chip thermal map, as they monitor temperature at a coarse granularity. In this paper we build a fine-grained thermal and power model of SCC using a state-of-the-art thermal modeling tool (Hotspot). We calibrate the model with measured data from chip sensors. We assess the predictive power of the thermal model and its main sources of error.

Additional Material : In the case you have access to one Intel SCC hardware, here is the link to the software package that we have developed in ERC Multitherman Lab for capturing the thermal and power sensor measurements of this hardware: SCC Software